AABCOOLING Copper Pad 15x15x0.1
- AABCOOLING Copper Pad 15 x 15 x 0.1 mm copper thermal pad made of Cu copper with a thermal conductivity of 401 W/mK. Lowers GPU, CPU, chipset and VRM temperatures. Use together with thermal paste.
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Copper thermal pad 15 x 15 x 0.1 mm
AABCOOLING Copper Pad 15x15x0.1 is a copper thermal pad (copper shim) made of high-quality Cu copper. Thanks to the excellent thermal conductivity of copper – 401 W/mK – it helps lower the temperatures of high-performance chips on motherboards and graphics cards in PCs, laptops and other electronics. It is a good alternative to a standard thermal pad.
Key features
- High-quality Cu copper
- Thermal conductivity of 401 W/mK
- Dimensions 15 x 15 mm, thickness 0.1 mm
- Easy installation
- Used together with a high-performance thermal paste
- Lower operating temperatures of components
Applications
The pad is placed between the chip and the heatsink, for example in:
- laptops – graphics chip, power delivery section,
- desktop PCs – graphics cards (between the heatsink and the GPU), power delivery section, RAM modules,
- consumer electronics and home appliances – LCD TVs, amplifiers and other heat-generating electronics,
- other electronic devices.
How to choose the thickness?
Choose a pad 0.1–0.2 mm thicker than the gap between the chip and the heatsink. When the heatsink is tightened, the contact pressure increases, which improves heat transfer and protects the chip from overheating caused by a pad of the wrong thickness.
Installation
- Make sure the surfaces of the chip, the heatsink and the copper pad are completely clean. For cleaning we recommend AAB IPA isopropyl alcohol – it removes old paste residue well and evaporates quickly.
- Apply a thin layer of high-quality thermal paste to the chip.
- Place the Copper Pad on it, apply a small amount of paste to the copper pad and mount the heatsink.
- Press the components together properly the first time – this is very important.
Important: Always use the Copper Pad together with thermal paste. Silicone-based pastes, which are prone to oxidation, are not recommended.
Specifications
- Dimensions: 15 x 15 x 0.1 mm
- Thickness: 0.1 mm
- Material: copper (Cu)
- Thermal conductivity: 401 W/mK
- Weight: 0.19 g
- Compatibility: CPU, GPU, chipset, other electronics
Package contents
- 1 × AABCOOLING Copper Pad 15x15x0.1