AABCOOLING Thermopad Glue 3M 20x130x3 2,4 W/mK

Thermal pad with 3M adhesive tape – 2.4 W/mK, 3 mm thick

AABCOOLING Thermopad 3M 20x130x3 2,4 W/mK is a thermally conductive pad with a thermal conductivity of 2.4 W/mK and double-sided 3M adhesive tape. It transfers heat from the hot component to the heat sink, while the tape bonds both parts immediately.

The pad comes as a single 20 × 130 mm strip that you can cut to the size you need with scissors. Thanks to its high compressibility it fills gaps from 2.5 to 2.8 mm between the chip and the heat sink.

Key features

• Thermal conductivity: 2.4 W/mK
• Double-sided 3M adhesive tape – bonds instantly
• Compressible material – precisely fills the gap between chip and heat sink
• Single 20 × 130 mm strip, cut to size
• Easy to apply
• Operating temperature range from -50°C to +200°C

Applications

• Laptops – graphics chips and power delivery section
• Desktop PCs – between the heat sink and the GPU of a graphics card, power delivery section (VRM), RAM modules
• Consumer electronics and appliances – LCD TVs, amplifiers and other heat-generating electronics

How to apply the thermal pad

1. Make sure both surfaces are completely clean.
2. Peel off the protective film on one side and stick the pad to the underside of the heat sink.
3. Peel off the second film and stick the heat sink to the component to be cooled (chipset, graphics chip, MOSFETs, RAM, etc.).
4. The tape bonds instantly, so position the parts precisely on the first attempt.

How to remove the heat sink

Carefully lever up one corner of the heat sink with a thin knife and detach it from the cooled component with gentle twisting movements. Clean both surfaces before reassembly.

Specifications

• Dimensions: 20 × 130 × 3 mm
• Thickness: 3 mm
• Thermal conductivity: 2.4 W/mK
• Operating temperature: from -50°C to +200°C
• Colour: grey
• Adhesive: double-sided 3M tape

Package contents

• 1 × AABCOOLING Thermopad 3M 20x130x3 2,4 W/mK