AABCOOLING Thermo Pad 30.30.0,13

Thermal pad 30 × 30 × 0.13 mm – 7 W/mK

AABCOOLING Thermo Pad 30.30.0,13 is a thermal pad with a thermal conductivity of 7 W/mK and a thickness of 0.13 mm. Placed between a heatsink and a heat-generating component, it transfers heat away efficiently.

Thanks to its high compressibility, it is suitable for gaps from 0.10 to 0.12 mm between the component and the heatsink. The pad comes as a single piece that you can cut to the size you need.

Key features

• Thermal conductivity: 7 W/mK
• Operating temperature: -50°C to +200°C
• Highly compressible and flexible – fills uneven, rough surfaces well
• Easy to install and remove
• No adhesive layer – held in place by heatsink pressure
• Single piece, cut to size

Applications

The thermal pad is used between the heatsink and heat-generating components in:

• laptops – graphics chips and power delivery,
• PC graphics cards – between the heatsink and the GPU, power delivery,
• RAM modules,
• consumer electronics – LCD TVs, amplifiers and other heat-generating electronics.

How to install the thermal pad

1. Make sure both surfaces are completely clean.
2. Remove the protective film from one side and place the pad on the chip.
3. Remove the film from the other side and press the heatsink down.

The pad has no adhesive – it must be held in place by mechanical pressure from the heatsink. It is easy to remove if you want to separate the surfaces again.

Specifications

• Dimensions: 30 × 30 × 0.13 mm
• Thickness: 0.13 mm
• Thermal conductivity: 7 W/mK
• Operating temperature: -50°C to +200°C
• Colour: grey
• Adhesive layer: none

In the box

• 1 × AABCOOLING Thermo Pad 30.30.0,13
• 1 × packaging